HALT Testing of Backward Soldered BGAs on a Military Product Online Version SMTnet Express, December 10, 2015, Subscribers: 23,782, Members: Companies: 14,767, Users: 39,402 Packaging Technology and Design Challenge for Fine Pitch Micro-Bump Cu
HALT Testing of Backward Soldered BGAs on a Military Product Online Version SMTnet Express, December 10, 2015, Subscribers: 23,782, Members: Companies: 14,767, Users: 39,402 Packaging Technology and Design Challenge for Fine Pitch Micro-Bump Cu
SMTnet Express, December 10, 2015, Subscribers: 23,782, Members: Companies: 14,767, Users: 39,402 Packaging Technology and Design Challenge for Fine Pitch Micro-Bump Cu-Pillar and BOT (Direct Bond on Substrate-Trace) Using TCNCP Myung-June Lee
We are please to introduce ourself- ,who is one of the SMT solution provider for Global customers, we can supply Automatic Insertion machines spare parts, SMT spare parts, (including feeder ,Nozzle,PCB
Manufacturer / Consultant / Service Provider
The third floor,No 3, Yanghua Road,Huangdong Village ,Fengguang town
Dongguan, 30 China
Phone: zoey@jinchensmt.com