Opening Keynote at the Assembly Technology Expo and
Optimizing Flip Chip Substrate Layout for Assembly Optimizing Flip Chip Substrate Layout for Assembly High-density flip chip applications are commonly limited by the available substrate technologies. Accordingly, considerable design efforts
Developing a Reliable Lead-free SMT Assembly Process Developing a Reliable Lead-free SMT Assembly Process What are the key process requirements to achieve reliable lead-free SMT assembly? Lead-free SMT can be achieved reliably if several
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830