Express Newsletter: coating performance (Page 1 of 68)

SMTnet Express - December 7, 2017

SMTnet Express, December 7, 2017, Subscribers: 31,092, Companies: 10,808, Users: 24,136 Utility of Dual Applicators for Non-Atomized Conformal Coating to Improve High-Volume Manufacturing Optimization Camille Sybert, Michael Szuch; Nordson ASYMTEK

SMTnet Express - November 26, 2017

SMTnet Express, November 26, 2017, Subscribers: 30,955, Companies: 13,080, Users: 23,968 Can Nano-Coatings Really Improve Stencil Performance? Tony Lentz; FCT ASSEMBLY, INC. Nano-coatings have been introduced by various manufacturers

The Effect of Coating and Potting on the Reliability of QFN Devices.

The Effect of Coating and Potting on the Reliability of QFN Devices. Online Version SMTnet Express, August 28, 2014, Subscribers: 23150, Members: Companies: 14012, Users: 36727 The Effect of Coating and Potting on the Reliability of QFN Devices

SMTnet Express - December 5, 2019

SMTnet Express, December 5, 2019, Subscribers: 32,833, Companies: 10,936, Users: 25,393 Masking for Conformal Coatings Credits: ACI Technologies, Inc. Conformal coatings are regularly employed to protect the surface of a soldered printed circuit

SMTnet Express - September 26, 2019

SMTnet Express, September 26, 2019, Subscribers: 32,237, Companies: 10,884, Users: 25,142 Thermal Capabilities of Solder Masks and Other Coating Materials - How High Can We Go? Credits: Lackwerke Peters GmbH + Co KG This paper focuses on three

SMTnet Express - August 8, 2019

SMTnet Express, August 8, 2019, Subscribers: 32,214, Companies: 10,853, Users: 25,321 Novel Approach to Void Reduction Using Microflux Coated Solder Preforms for QFN/BTC Packages that Generate Heat Credits: Alpha Assembly Solutions The requirement

SMTnet Express - August 1, 2019

coatings (most actively on relatively thin, electr

SMTnet Express - January 18, 2018

SMTnet Express, January 18, 2018, Subscribers: 31,180, Companies: 10,857, Users: 24,296 Fine Pitch Cu Pillar with Bond on Lead (BOL) Assembly Challenges for High Performance Flip Chip Package Nokibul Islam, Vinayak Pandey, KyungOe Kim; STATS Chip

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