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Optimizing Flip Chip Substrate Layout for Assembly Optimizing Flip Chip Substrate Layout for Assembly High-density flip chip applications are commonly limited by the available substrate technologies. Accordingly, considerable design efforts
SMTnet Express, March 12, 2015, Subscribers: 22,490, Members: Companies: 14,252 , Users: 37,867 Miniaturization with Help of Reduced Component to Component Spacing Jonas Sjoberg, Ranilo Aranda, David Geiger, Anwar Mohammed, Murad Kurwa
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