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727 component reject results

Express Newsletter: component reject (Page 1 of 73)

Controlled Convection Rates

SMTnet Express - July 22, 2021

A Novel Local Search Integer-Programming-Based Heuristic for PCB Assembly on Collect-and-Place Machines

Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints.

SMTnet Express - May 19, 2022

SMT Express, Volume 3, Issue No. 4 - from SMTnet.com

First Principles of Solder Reflow

Development of Ultra-Multilayer Printed Circuit Board

A New (Better) Approach to Tin Whisker Mitigation

A Practical Guide to Achieving Lead-Free Electronics Assembly

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