SMTnet Express, December 1, 2016, Subscribers: 27,507, Companies: 15,035, Users: 41,441 Review of Interconnect Stress Testing Protocols and Their Effectiveness in Screening Microvias Edward Arthur; Raytheon , Charles Busa, Wade Goldman P.E., Alisa
SMTnet Express, July 26, 2018, Subscribers:31,208, Companies: 11,001, Users: 24,976 Expanding IEEE Std 1149.1 Boundary-Scan Architecture Beyond Manufacturing Test of Printed Circuit Board Assembly Jun Balangue; Keysight Technologies This paper
Selective Soldering Process Selective Soldering Process Although many through-hole components are being replaced by their surface mount (SMT) counterparts, printed circuit boards (PCBs) are still being designed with both types of components
Probably the biggest issue with 0201 chip components
Sustaining a Robust Fine Feature Printing Process Sustaining a Robust Fine Feature Printing Process With the introduction of 01005 chip components and 0.3 mm pitch CSP devices, electronic component packaging is pushing surface mount technology
BGA Package Component Reliability After Long-Term Storage BGA Package Component Reliability After Long-Term Storage In 2008, the white paper Component Reliability After Long Term Storage was published in support of shelf life extension
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