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Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages

SMTnet Express - December 21, 2017

SMTnet Express, December 21, 2017, Subscribers: 31,120, Companies: 10,825, Users: 24,210 Printing and Curing of Conductive Ink Track on Curvature Substrate using Fluid Dispensing System and Oven Rd K . Khirotdin, Nurhafizzah Hassan, Hi H. Siang

SMT Express, Issue No. 3 - from SMTnet.com

Air Flow Measurement in Electronic Systems

Air Flow Measurement in Electronic Systems Air Flow Measurement in Electronic Systems Electronic circuit boards create some of the most complex and highly three dimensional fluid flows in both air and liquid. The combination of open channel

Thermal Spot Curing of Adhesives with Photonic Energy; a novel fiber delivery method of radiant heating to accelerate the polymerization of thermally active adhesives

PCB Dynamic Coplanarity At Elevated Temperatures

, Akrometrix , Cisco Systems , Flextronics With the a

Environmental Compliance Reporting � Mastering a Moving Target

Flux Collection and Self-Clean Technique in Reflow Applications

Flux Collection and Self-Clean Technique in Reflow Applications Flux Collection and Self-Clean Technique in Reflow Applications The flux management system for a reflow oven is highly critical to the quality, cost, and yield of a reflow process

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