Are Separate Solder Flip-Chip Bonders Still Required? Are Separate Solder Flip-Chip Bonders Still Required? Increasing miniaturization is now encouraging manufacturers of handheld devices to stack bare dies or packages. As the process
SMT Express, Volume 3, Issue No. 7 - from SMTnet.com Volume 3, Issue No. 7 Thursday, July 18, 2001 Featured Article Return to Front Page Contract Manufacturing In China: The Advantages, the Obstacles by W.J. Peterson , Foxconn, Inc
