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Development of Ultra-Multilayer Printed Circuit Board

SMT Express, Issue No. 3 - from SMTnet.com

Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures

Air Powered Dispensing

The Pin-in-Paste (or AART) Process for Odd Form and Through Hole Printed Circuit Boards

SMT Express, Volume 4, Issue No. 5 - from SMTnet.com

Solder Materials Science Gets Small as Miniaturization Challenges Old Rules

Recommendations for Installing Flash LEDs on Flex Circuits

Recommendations for Installing Flash LEDs on Flex Circuits Recommendations for Installing Flash LEDs on Flex Circuits For the mobile market some PCB assemblies have been converted to flex circuit assemblies, in part because flex circuit assembly

DOE for Process Validation Involving Numerous Assembly Materials and Test Methods

SMT Express, Volume 5, Issue No. 3 - from SMTnet.com