High Reliability Lead-free Solder SN100C(Sn-0.7Cu-0.05Ni+Ge) High Reliability Lead-free Solder SN100C(Sn-0.7Cu-0.05Ni+Ge) While the situation varies from country to country, nearly one year after the EU RoHS Directive came into force
Hermetically Sealed SMD Tantalum Capacitors Hermetically Sealed SMD Tantalum Capacitors by: I.Zednickova, M.Biler, J.Petrzilek, T.Zednicek; AVX Corporation The article presents improvement of stability parameters of tantalum surface mounted
. Skwarek, M. Pluska, J. Ratajczak, K. Witek; The Instit
SMTnet Express September 5, 2013, Subscribers: 26246, Members: Companies: 13466, Users: 35123 Conformal Surface Plasmons Propagating on Ultrathin and Flexible Films by Xiaopeng Shen,Tie Jun Cui,Diego Martin-Cano, Francisco J. Garcia
SMTnet Express, October 12, 2017, Subscribers: 30,913, Companies: 10,757, Users: 23,915 Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow- Results of an Industry Round-Robin David Pinsky, Tom Hester - Raytheon , Dr. Anduin Touw - The Boeing
SMTnet Express, August 1, 2019, Subscribers: 32,197, Companies: 10,845, Users: 24,998 Tin Whiskers: Risks with Lead Free | Part I Credits: ACI Technologies, Inc. Tin (Sn) metal displays the characteristic of growing "tin whiskers" from pure tin
Electrical Performance of an Organic, Z-interconnect, Flip-Chip Substrate Electrical Performance of an Organic, Z-interconnect, Flip-Chip Substrate Endicott Interconnect Technologies Credit/Source: Michael J. Rowlands, Rabindra Das More and more
Liquid Tin Corrosion and Lead Free Wave Soldering Liquid Tin Corrosion and Lead Free Wave Soldering Corrosion of solder pots and solder pot components in wave soldering equipment has been reduced with the introduction of corrosion resistant
