SMTnet Express, July 24, 2014, Subscribers: 22981, Members: Companies: 13953, Users: 36523 Copper Wire Bond Failure Mechanisms. Randy Schueller, Ph.D.; DfR Solutions Wire bonding a die to a package has traditionally been performed using either
SMTnet Express, August 31, 2017, Subscribers: 30,770, Companies: 10,706, Users: 23,739 NSOP Reduction for QFN RFIC Packages Mumtaz Y. Bora; Peregrine Semiconductor Wire bonded packages using conventional copper leadframe have been used in industry
SMTnet Express, January 8, 2020, Subscribers: 33,435, Companies: 10,958, Users: 25,498 Copper/Epoxy Joints in Printed Circuit Boards: Manufacturing and Interfacial Failure Mechanisms Credits: Polymer Competence Center Leoben GmbH PCBs have a wide
SMTnet Express, December 11, 2014, Subscribers: 23,586, Members: Companies: 14,135 , Users: 37,386 Failure Modes in Wire bonded and Flip Chip Packages Hikmat Chammas - Peregrine Semiconductor The growth of portable and wireless products is driving
SMT Express, Volume 2, Issue No. 9 - from SMTnet.com Volume 2, Issue No. 9 Thursday, September 14, 2000 Featured Article Return to Front Page Book Review Reviewed by Dave Fish (davef ), Pandion Electronics, Inc Title: Wire Bonding
