Defect Free QFN Assembly Defect Free QFN Assembly The problem with soldering QFN packages is that they float, skew and tilt on the 'domed' melted solder during the SMT re-flow process. This floating, skewing and/or tilting will lead to solder
SMTnet Express, November 22, 2017, Subscribers: 31,034, Companies: 10,792, Users: 24,082 Factors Affecting the Adhesion of Thin Film Copper on Polyimide David Ciufo, Hsin-Yi Tsai and Michael J. Carmody; Intrinsiq Materials Inc. The use of copper
SMTnet Express, May 12, 2022, Subscribers: 25,588, Companies: 11,569, Users: 27,213 Electronics Manufacturing Technical Articles Filling of Microvias and Through Holes by Electrolytic Copper Plating –Current Status and Future
SMTnet Express, April 30, 2015, Subscribers: 22,686, Members: Companies: 14,334 , Users: 38,119 Signal Transmission Loss due to Copper Surface Roughness in High-Frequency Region Elaine Liew; Mitsui Copper Foil Malaysia, Shah Alam Malaysia, Taka
SMTnet Express, May 27, 2021, Subscribers: 27,090, Companies: 11,365, Users: 26,673 Filling of Microvias and Through Holes by Electrolytic Copper Plating - Current Status and Future Outlook The electronics industry is further
SMTnet Express, July 22, 2021, Subscribers: 26,870, Companies: 11,403, Users: 26,753 Impact of Assembly Cycles on Copper Wrap Plating The PWB industry needs to complete reliability testing in order to define the minimum copper wrap
