Express Newsletter: copper leached from solder (Page 1 of 114)

Defect Free QFN Assembly

Defect Free QFN Assembly Defect Free QFN Assembly The problem with soldering QFN packages is that they float, skew and tilt on the 'domed' melted solder during the SMT re-flow process. This floating, skewing and/or tilting will lead to solder

SMTnet Express - November 22, 2017

SMTnet Express, November 22, 2017, Subscribers: 31,034, Companies: 10,792, Users: 24,082 Factors Affecting the Adhesion of Thin Film Copper on Polyimide David Ciufo, Hsin-Yi Tsai and Michael J. Carmody; Intrinsiq Materials Inc. The use of copper

SMTnet Express - May 12, 2022

SMTnet Express, May 12, 2022, Subscribers: 25,588, Companies: 11,569, Users: 27,213 Electronics Manufacturing Technical Articles Filling of Microvias and Through Holes by Electrolytic Copper Plating –Current Status and Future

SMTnet Express - April 30, 2015

SMTnet Express, April 30, 2015, Subscribers: 22,686, Members: Companies: 14,334 , Users: 38,119 Signal Transmission Loss due to Copper Surface Roughness in High-Frequency Region Elaine Liew; Mitsui Copper Foil Malaysia, Shah Alam Malaysia, Taka

SMTnet Express - May 27, 2021

SMTnet Express, May 27, 2021, Subscribers: 27,090, Companies: 11,365, Users: 26,673 Filling of Microvias and Through Holes by Electrolytic Copper Plating - Current Status and Future Outlook The electronics industry is further

SMTnet Express - July 22, 2021

SMTnet Express, July 22, 2021, Subscribers: 26,870, Companies: 11,403, Users: 26,753 Impact of Assembly Cycles on Copper Wrap Plating The PWB industry needs to complete reliability testing in order to define the minimum copper wrap

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