SMTnet Express, July 24, 2014, Subscribers: 22981, Members: Companies: 13953, Users: 36523 Copper Wire Bond Failure Mechanisms. Randy Schueller, Ph.D.; DfR Solutions Wire bonding a die to a package has traditionally been performed using either
SMTnet Express March 28, 2013, Subscribers: 26288, Members: Companies: 13327, Users: 34493 A Designed Experiment for the Influence of Copper Foils on Impedance, DC Line Resistance and Insertion Loss by: Alexander Ippich; Multek For the last couple
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