SMTnet Express, January 15, 2014, Subscribers: 26472, Members: Companies: 13551, Users: 35633 Advanced Rework Technology and Processes for Next Generation Large Area Arrays, 01005, PoP and QFN Devices by Brian Czaplicki; Air-Vac Engineering BGA
SMTnet Express, February 12, 2015, Subscribers: 22,336, Members: Companies: 14,215, Users: 37,692 Evaluating the Mechanical Reliability of Ball Grid Array (BGA) Flexible Surface-Mount Electronics Packaging under Isothermal Ageing Sabuj Mallik
A High Performance and Cost Effective Molded Array Package Substrate A High Performance and Cost Effective Molded Array Package Substrate In this article we present both a relatively new and innovative family of packages that is suitable
