1022 cr technology rti 7%2c500 results

PCB Dynamic Coplanarity At Elevated Temperatures

Thermal Spot Curing of Adhesives with Photonic Energy; a novel fiber delivery method of radiant heating to accelerate the polymerization of thermally active adhesives

New Methods of Testing PCB Traces Capacity and Fusing

New Methods of Testing PCB Traces Capacity and Fusing New Methods of Testing PCB Traces Capacity and Fusing by: Norocel Codreanu, Radu Bunea, Paul Svasta; "Politehnica" University of Bucharest, Center for Technological Electronics

Reliability Enhancement of Wafer Level Packages with Nano-Column-Like Hollow Solder Ball Structures

Using Flexible Circuits as an Electronic Interconnection... Do's and Don'ts

Connector Models - Are They Any Good?

SMTnet Express - January 9, 2014

SMTnet Express, January 9, 2014, Subscribers: 26467, Members: Companies: 13548, Users: 35610 Embedded Passive Technology by Hikmat Chammas; Honeywell International Embedded Passive Technology is a viable technology that has been reliably used

SMTnet Express - March 13, 2014

SMTnet Express, March 13, 2014, Subscribers: 22531, Members: Companies: 13818, Users: 35857 Stencil Design Guidelines for Electronics Assembly Technologies Oliver Krammer; Budapest University of Technology and Economics. A student competition

SMTnet Express - November 19, 2014

SMTnet Express, November 19, 2014, Subscribers: 23530, Members: Companies: 14112, Users: 37185 Effects of Packaging Materials on the Lifetime of LED Modules Under High Temperature Test Lei Nie, Wenjing Xiang - Hubei University of Technology

Are Separate Solder Flip-Chip Bonders Still Required?