Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints. Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints. The purpose
SMTnet Express, February 6, 2020, Subscribers: 33,800, Companies: 10,971, Users: 25,576 Accurately Capturing System-Level Failure of Solder Joints Credits: DfR Solutions Consortium Projects - Thermal Cycling Reliability Consortium projects allow
Inclusion Voiding in Gull Wing Solder Joints SMTnet Express August 30, 2012, Subscribers: 25432, Members: Companies: 8960, Users: 33565 Inclusion Voiding in Gull Wing Solder Joints First published in the 2012 IPC APEX EXPO technical conference
SMTnet Express, June 19, 2014, Subscribers: 22851, Members: Companies: 13906, Users: 36363 Anisotropic grain growth and crack propagation in eutectic microstructure under cyclic temperature annealing in flip-chip SnPb composite solder joints Y
crack of solder joint as it'll pass the regular tes
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
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Gainesville, GA USA
Phone: (770) 538-0411