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SMT Express, Volume 4, Issue No. 6 - from SMTnet.com

THT in-line Inspection: Contradiction or greater Efficiency?

SMT Express

Overcoming Logistic, Economic and Technical Challenges to Implementing Functional Test in High Mix / High Volume Production Environments

SMTnet Express - August 7, 2014

SMTnet Express, August 7, 2014, Subscribers: 23058, Members: Companies: 13975, Users: 36604 Gold Embrittlement In Lead-Free Solder. Craig Hillman, Nathan Blattau, Joelle Arnold, Thomas Johnston, Stephanie Gulbrandsen; DfR Solutions , Julie Silk

SMTnet Express - July 9, 2015

SMTnet Express, July 9, 2015, Subscribers: 23,004, Members: Companies: 14,461 , Users: 38,507 Predicting Fatigue of Solder Joints Subjected to High Number of Power Cycles Craig Hillman, Nathan Blattau; DfR Solutions , Matt Lacy; Advanced Energy

Head-in-Pillow BGA Defects

Defect Coverage for Non-Intrusive Board Tests

The Reliability Challenges of QFN Packaging

01005 production goes industry wide