SMTnet Express, July 12, 2018, Subscribers: 31,180, Companies: 10,985, Users: 24,934 Improving Thermal Cycle and Mechanical Drop Impact Resistance of a Lead-free Tin-Silver-Bismuth-Indium Solder Alloy with Minor Doping of Copper Additive T. Wada
SMTnet Express, August 30, 2018, Subscribers: 31,289, Companies: 11,033, Users: 25,137 Does Thermal Cycling Impact the Electrical Reliability of a No-Clean Solder Paste Flux Residue Eric Bastow; Indium Corporation No-clean solder pastes are widely
SMTnet Express, November 21, 2018, Subscribers: 31,479, Companies: 11,087, Users: 25,424 Understanding the Effect of Different Heating Cycles on Post-Soldering Flux Residues and the Impact on Electrical Performance Brook Sandy-Smith, Indium
SMTnet Express, December 20, 2018, Subscribers: 31,551, Companies: 10,666, Users: 25,526 Process Optimization for Fine Feature Solder Paste Dispensing Credits: Indium Corporation With the rapid trend towards miniaturization in surface mount
SMTnet Express, July 25, 2019, Subscribers: 32,181, Companies: 10,840, Users: 24,976 Voiding Performance with Solder Pastes Containing Modified SAC Alloys for Automotive Applications in Bottom Terminated Component Assemblies Credits: Indium
