Reliability Enhancement of Wafer Level Packages with Nano-Column-Like Hollow Solder Ball Structures Reliability Enhancement of Wafer Level Packages with Nano-Column-Like Hollow Solder Ball Structures by: Ronak Varia, Xuejun Fan; Lamar University
-off-the-shelf ball/column grid array packaging (COT
INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 92, (#ts#)) SMT Express, Volume 3, Issue No. 12 - from SMTnet.com Volume 3, Issue No. 12 Wednesday, December 19, 2001
