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Joule Heating Effects on the Current Carrying Capacity of an Organic Substrate for Flip-Chip Applications

Joule Heating Effects on the Current Carrying Capacity of an Organic Substrate for Flip-Chip Applications If you don't see images, please visit online version at: http://www.smtnet.com/express/ News   Forums   SMT Equipment   Company

Stencil Design using Regression

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Anisotropic Conductive Adhesive Bonding - A high-quality Interconnection Technique

IPC APEX EXPO Surges In San Diego

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Can You Afford Not To Improve in 2009?

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Conference & Exhibition: March 31 - April 2 - 2009Meetings: March 29 - April 2, 2009 Mandalay Bay Resort & Convention Center

professionals, the APEX pre-show and post-show newslette

Conference & Exhibition: March 31 - April 2 - 2009Meetings: March 29 - April 2, 2009 Mandalay Bay Resort & Convention Center

professionals, the APEX pre-show and post-show newslette