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SMTnet Express, September 30, 2021, Subscribers: 26,663, Companies: 11,449, Users: 26,872 Solutions for Selective Soldering of High Thermal Mass and Fine-Pitch Components The selective soldering process has evolved to become a
SMTnet Express, November 13, 2014, Subscribers: 23528, Members: Companies: 14104, Users: 37155 Advanced Thermal Management Solutions on PCBs for High Power Applications Gregor Langer, Markus Leitgeb - Austria Technologie & Systemtechnik AG, Johann
miniaturization of power components, the need for
Power Supply Control from PCB to Chip Core Power Supply Control from PCB to Chip Core As silicon technology advances to enable higher density ASICs, the core logic voltage decreases. The lower voltage, in combination with higher current
SMTnet Express, October 15, 2015, Subscribers: 23,684, Members: Companies: 14,684, Users: 39,145 Optimizing the Insulated Metal Substrate Application with Proper Material Selection and Circuit Fabrication Dave Sommervold, Chris Parker, Steve
