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Printed Circuit Board Tracking with RFID: Speed, Efficiency and Productivity Made Simple

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Enterprise-wide Supplier Quality Management: The Big Payoff for Global SPC

Assembly And Reliability Issues Associated With Leadless Chip Scale Packages

DOE for Process Validation Involving Numerous Assembly Materials and Test Methods

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Assembly Process Variables Voiding At A Thermal Interface

Stencil Design using Regression

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PWB Manufacturing Variability Effects on High Speed SerDes Links: Statistical Insights from Thousands of 4-Port SParameter Measurements

Conforming To a Higher Standard of Reliability

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Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages