Reliability of BGA Solder Joints after Re-Balling Process SMTnet Express October 4, 2012, Subscribers: 25550, Members: Companies: 9004, Users: 33746 Reliability of BGA Solder Joints after Re-Balling Process First published in the 2012 IPC APEX EXPO
The Regulatory and Environment Status of Tetrabromobisphenol-A In Printed Wiring Boards SMTnet Express August 23, 2012, Subscribers: 25414, Members: Companies: 8957, Users: 33515 The Regulatory and Environment Status of Tetrabromobisphenol
Pad Cratering - The Invisible Threat to the Electronics Industry SMTnet Express September 6, 2012, Subscribers: 25455, Members: Companies: 8972, Users: 33613 Pad Cratering - The Invisible Threat to the Electronics Industry First published
Scaling LCA with IPC-175x SMTnet Express June 8, 2012, Subscribers: 25249, Members: Companies: 8892, Users: 33210 Scaling LCA with IPC-175x First published in the 2012 IPC APEX EXPO technical conference proceedings. by: Jørgen Vos, Industry
Minimizing Voiding In QFN Packages Using Solder Preforms SMTnet Express July 27, 2012, Subscribers: 25333, Members: Companies: 8933, Users: 33366 Minimizing Voiding In QFN Packages Using Solder Preforms First published in the 2012 IPC APEX EXPO
Application Of Build-in Self Test In Functional Test Of DSL SMTnet Express May 23, 2012, Subscribers: 25234, Members: Companies: 8880, Users: 33129 Application Of Build-in Self Test In Functional Test Of DSL First published in the 2012 IPC APEX
