Optimizing Flip Chip Substrate Layout for Assembly Optimizing Flip Chip Substrate Layout for Assembly High-density flip chip applications are commonly limited by the available substrate technologies. Accordingly, considerable design efforts
Reworking QFN's Newly Developed Cost Effective Approach Reworking QFN's Newly Developed Cost Effective Approach As with any rework process, the pasting of the component is a sequential process. Each step is designed to minimize the risk of a
Stencil Design using Regression If you don't see images please visit online version at: http://www.smtnet.com/express/ Stencil Design using Regression The complexity of Printed Circuit Assembly process is increasing day by day and causing
Testing Digital Designs - The Boundary-scan Balance Testing Digital Designs - The Boundary-scan Balance As several industry pundits have expressed in recent years: "the era of 'one test method fits all' seems well behind us." For most test
3D ICs With TSVs - Design Challenges And Requirements Heat Management in Printed Circuit Boards This report discusses the significance of heat management in the design of printed circuit boards (PCB).After an introduction into the basics of PCBs
Development of a Design & Manufacturing Environment for Reliable and Cost- Effective PCB Embedding Technology Development of a Design & Manufacturing Environment for Reliable and Cost- Effective PCB Embedding Technology The desire to have more
Electronic manufacturing services - electronic design, development and manufacturing. Circuit board design, prototyping, FPGA services, signal integrity and simulation, pcb assembly. Factories in California USA and Malaysia.
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Santa Clara, CA USA
Phone: +1 408 980 0400
