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SMTnet Express February 14 - 2013, Subscribers: 26181

SMT Express, Volume 3, Issue No. 7 - from SMTnet.com

Handbook Editor: Glenn R. Blackwell Publisher

Novel Probing Concepts for Mass-Production Tests: Design and Challenges

A Study of PCB Insertion Loss Variation in Manufacturing Using a New Low Cost Metrology

SMTnet Express - June 29, 2017

SMTnet Express, June 29, 2017, Subscribers: 30,527, Companies: 10,624, Users: 23,443 Round Robin of High Frequency Test Methods by IPC-D24C Task Group Glenn Oliver, Jonathan Weldon - DuPont , Chudy Nwachukwu - Isola, John Coonrod - Rogers

High Reliability Lead-free Solder SN100C(Sn-0.7Cu-0.05Ni+Ge)

Improvement of Organic Packaging Thermal Cycle Performance Measurement

Improvement of Organic Packaging Thermal Cycle Performance Measurement  Featured Article Improvement of Organic Packaging Thermal Cycle Performance Measurement Endicott Interconnect Technologies Glenn O. Dearing, Paul J. Hart Flip Chip Plastic

Screening for Counterfeit Electronic Components

How Clean Is Clean

How Clean Is Clean