SMTnet Express, September 11, 2014, Subscribers: 23214, Members: Companies: 14043, Users: 36809 Reliability of Reworked QFNs. Bob Wettermann; Business Electronics Soldering Technologies (BEST) Inc. Recently, the impact of leadless device
the increasing demand of device miniaturization, hi
Embedded Thermoelectric Cooling Article Embedded Thermoelectric Cooling Thin film thermoelectric devices offer a fundamentally new operating regime for integrated, active cooling solutions and localized thermal management, yet the assembly
Strength of Lead-free BGA Spheres in High Speed Loading Strength of Lead-free BGA Spheres in High Speed Loading Concern about the failure of lead-free BGA packages when portable devices such as cell phones are accidentally dropped and a general
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