943 dewetting or non wetting is the same thing? results

SMT Express, Volume 3, Issue No. 4 - from SMTnet.com

Use of Non Etching Adhesion Promoters in Advanced PCB Applications

Use of Non Etching Adhesion Promoters in Advanced PCB Applications If you don't see images, visit online version: http://www.smtnet.com/express/ Use of Non Etching Adhesion Promoters in Advanced PCB Applications Based on tests carried

SMTnet Express - April 16, 2020

Flux Collection and Self-Clean Technique in Reflow Applications

Head-in-Pillow BGA Defects

Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint

SMT Express, Issue No. 2 - from SMTnet.com

SMTnet Express - March 06, 2014

SMTnet Express - December 20, 2018

Laser Direct Imaging of tracks on PCB covered with laser photoresist

Integrated Offset Placement in Electronics Assembly Equipment — The Answer for Solder Paste Misalignment