925 die move reflow results

SMTnet Express - May 8, 2014

SMTnet Express, May 8, 2014, Subscribers: 22716, Members: Companies: 13872, Users: 36158 Challenges in Bare Die Mounting Larry Gilg, Die Products Consortium Bare die mounting on multi-device substrates has been in use in the microelectronics

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3D ICs With TSVs - Design Challenges And Requirements

Power Supply Control from PCB to Chip Core

SMTnet Express - December 5, 2013

SMT Express, Volume 2, Issue No. 2 - from SMTnet.com

Integrated Offset Placement in Electronics Assembly Equipment — The Answer for Solder Paste Misalignment

Integrated Offset Placement in Electronics Assembly Equipment — The Answer for Solder Paste Misalignment

Are Separate Solder Flip-Chip Bonders Still Required?

Are Separate Solder Flip-Chip Bonders Still Required? Are Separate Solder Flip-Chip Bonders Still Required? Increasing miniaturization is now encouraging manufacturers of handheld devices to stack bare dies or packages. As the process

Criminal Prosecution - Who can be held liable for the sale of counterfeit parts?