SMTnet Express, October 24, 2013, Subscribers: 26339, Members: Companies: 13466, Users: 35314 Effect of Reflow Profile on Intermetallic Compound Formation by I. Siti Rabiatull Aisha, A. Ourdjini, M. A. Azmah Hanim, O. Saliza; Universiti Teknologi
Advanced Thermal Interface Materials for Enhanced Flip Chip BGA Advanced Thermal Interface Materials for Enhanced Flip Chip BGA Increased functionality and performance requirements for microprocessors and ASICs have resulted in a trend
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