Minimizing Voiding In QFN Packages Using Solder Preforms SMTnet Express July 27, 2012, Subscribers: 25333, Members: Companies: 8933, Users: 33366 Minimizing Voiding In QFN Packages Using Solder Preforms First published in the 2012 IPC APEX EXPO
SMTnet Express, January 5, 2014, Subscribers: 23,708, Members: Companies: 14,158 , Users: 37,476 The Last Will And Testament of the BGA Void Dave Hillman, Dave Adams, Tim Pearson, Brad Williams, Brittany Petrick, Ross Wilcoxon - Rockwell Collins
Hot Nitrogen For Wave Soldering SMTnet Express July 5, 2012, Subscribers: 25307, Members: Companies: 8910, Users: 33309 Hot Nitrogen For Wave Soldering First published in the 2012 IPC APEX EXPO technical conference proceedings. by: Laurent
SMTnet Express, October 10, 2019, Subscribers: 32,263, Companies: 10,893, Users: 25,93 Fill the Void IV: Elimination of Inter-Via Voiding Credits: FCT ASSEMBLY, INC. Voids are a plague to our electronics and must be eliminated! Over the last few
SMTnet Express, October 17, 2019, Subscribers: 32,268, Companies: 10,900, Users: 25,212 Effect Of Voids On Thermo-Mechanical Reliability of Solder Joints Credits: Alpha Assembly Solutions Despite being a continuous subject of discussion
SMTnet Express, October 3, 2018, Subscribers: 31,373, Companies: 11,056, Users: 25,258 Fill the Void II: An Investigation into Methods of Reducing Voiding Tony Lentz - FCT Assembly , Patty Chonis, JB Byers - A-Tek Systems Voids in solder joints
published in the 2012 IPC APEX EXPO technical con
IPC is the trade association for the printed wiring board and electronics assembly industries.
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