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The Relationship between Backward Compatible Assembly and Microstructure on the Thermal Fatigue Reliability of an Extremely Large Ball Grid Array

A Study of PCB Insertion Loss Variation in Manufacturing Using a New Low Cost Metrology

Low Cost Metrology First published in the 2012 IPC

New Developments in PCB Laminates

New Developments in PCB Laminates Online Version SMTnet Express July 19, 2012, Subscribers: 25329, Members: Companies: 8927, Users: 33365 New Developments in PCB Laminates First published in the 2012 IPC APEX EXPO technical conference proceedings

An Investigation of Whisker Growth on Tin Coated Wire and Braid

IPC APEX EXPO technical conference proceedings.

Strength of Lead-free BGA Spheres in High Speed Loading

SMT Line Improvements for High Mix, Low Volume Electronics Manufacturing

Evaluating The Accuracy Of a Nondestructive Thermocouple Attach Method For Area-Array Package Profiling

SMTnet Express April 4 - 2013, Subscribers: 26307

SMTnet Express April 4, 2013, Subscribers: 26307, Members: Companies: 13337, Users: 34515 IPC 9252A Electrical Test Considerations & Military Specifications versus Electrical Test by: Todd L Kolmodin, VP Quality; Gardien Services USA (Know Your

SMTnet Express - December 19, 2019

SMT Express, Issue No. 7 - from SMTnet.com

Article Return to Front Page IPC SMEMA Council APEX Ele