SMTnet Express, August 12, 2021, Subscribers: 26,820, Companies: 11,423, Users: 26,800 Analysis of the Influence of Shrinkage Tensile Stress in Potting Material on the Anti-Overload Performance of the Circuit Board In this article
The Effect of Coating and Potting on the Reliability of QFN Devices. Online Version SMTnet Express, August 28, 2014, Subscribers: 23150, Members: Companies: 14012, Users: 36727 The Effect of Coating and Potting on the Reliability of QFN Devices
SMTnet Express, June 7, 2018, Subscribers: 31,097, Companies: 10,956, Users: 24,801 Potting Under Vacuum or Atmosphere? Scheugenpflug; Scheugenpflug Inc. Potting under vacuum or atmospheric conditions? This question about the correct procedure
SMTnet Express May 9, 2013, Subscribers: 26129, Members: Companies: 13373, Users: 34687 Impact of Dust on Printed Circuit Assembly Reliability by: Bo Song, Michael H. Azarian, Michael G. Pecht; CALCE Atmospheric dust consists of solids suspended
Dross and the Selective Soldering Process Dross and the Selective Soldering Process In the selective soldering process, dross can be detrimental. Dross (and I use this term to encompass all surface contamination) is created in conjunction
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