1138 dust particle specification for smt clean room results

A New Stenciling Method for Reworking SMT Components

A New Stenciling Method for Reworking SMT Components A New Stenciling Method for Reworking SMT Components When reworking more complex SMT components such as finer pitch SMT components, SMTconnectors and even area array devices, the most common

SMTnet Express - June 4, 2015

Application Of Build-in Self Test In Functional Test Of DSL

SMTnet Express - October 24, 2019

SMTnet Express, October 24, 2019, Subscribers: 32,268, Companies: 10,908, Users: 25,250 Investigation of PCB Failure after SMT Manufacturing Process Credits: ACI Technologies, Inc. An ACI Technologies customer inquired regarding PCB failures

SMT Express, Issue No. 4 - from SMTnet.com

SMT Express, Issue No. 4 - from SMTnet.com Volume 1, Issue No. 4 Tuesday, September 14, 1999 Proof Of Design a continuing column by The MoonMan Installment 2: Initial DFM/CE Development Phases Continued from Front Page What made him depart

Evaluating The Accuracy Of a Nondestructive Thermocouple Attach Method For Area-Array Package Profiling

An Effective Design of Experiment Strategy to Optimize SMT Processes

An Effective Design of Experiment Strategy to Optimize SMT Processes An Effective Design of Experiment Strategy to Optimize SMT Processes It is now widely accepted that using designed experiments is the most effective way to optimize surface mount

Flux Collection and Self-Clean Technique in Reflow Applications

Flux Collection and Self-Clean Technique in Reflow Applications Flux Collection and Self-Clean Technique in Reflow Applications The flux management system for a reflow oven is highly critical to the quality, cost, and yield of a reflow process

Cleanliness of Stencils and Cleaned Misprinted Circuit Boards

Cleanliness of Stencils and Cleaned Misprinted Circuit Boards Cleanliness of Stencils and Cleaned Misprinted Circuit Boards There are long-established standards and test methods for ionic cleanliness levels for bare printed circuit boards

Defect Free QFN Assembly

Defect Free QFN Assembly Defect Free QFN Assembly The problem with soldering QFN packages is that they float, skew and tilt on the 'domed' melted solder during the SMT re-flow process. This floating, skewing and/or tilting will lead to solder