SMTnet Express, December 16, 2017, Subscribers: 31,015, Companies: 10,789, Users: 24,054 Controlling Voiding Mechanisms in the Reflow Soldering Process Keith Sweatman, Takatoshi Nishimura, Kenichiro Sugimoto, Akira Kita; Nihon Superior Co., Ltd
SMTnet Express, November 22, 2017, Subscribers: 31,034, Companies: 10,792, Users: 24,082 Factors Affecting the Adhesion of Thin Film Copper on Polyimide David Ciufo, Hsin-Yi Tsai and Michael J. Carmody; Intrinsiq Materials Inc. The use of copper
SMTnet Express, December 14, 2017, Subscribers: 30,979, Companies: 10,811, Users: 24,182 PCB Sourcing Using PCQR 2 Al Block, Naji Norder, Chris Joran; National Instruments In a global market, it is often difficult to determine the best PCB
SMTnet Express, January 4, 2018, Subscribers: 31,139, Companies: 10,838, Users: 24,240 IPC-1782 Standard for Traceability Supporting Counterfeit Components Michael Ford; Mentor Graphics Traceability has grown from being a specialized need
SMTnet Express, January 11, 2018, Subscribers: 31,165, Companies: 10,847, Users: 24,274 High-Performance Ink-Jet Printed Graphene Resistors Formed With Environmentally-Friendly Surfactant-Free Inks For Extreme Thermal Environments Monica Michel
SMTnet Express, January 18, 2018, Subscribers: 31,180, Companies: 10,857, Users: 24,296 Fine Pitch Cu Pillar with Bond on Lead (BOL) Assembly Challenges for High Performance Flip Chip Package Nokibul Islam, Vinayak Pandey, KyungOe Kim; STATS Chip
SMTnet Express, February 1, 2018, Subscribers: 31,216, Companies: 10,874, Users: 24,342 Electronic Does Not Equal Smart: Service Documentation and Brand Quality Muhammad Askar; Mentor Graphics This paper briefly summarizes the technologies
SMTnet Express, February 8, 2018, Subscribers: 31,242, Companies: 10,885, Users: 24,377 Mixed Voltages And Aluminum Conductors: Assesing New Electrcal Technology Olivier Neuman; Mentor Graphics The architecture of vehicle electrical systems
SMTnet Express, March 8, 2018, Subscribers: 31,288, Companies: 10,911, Users: 24,465 Optimization of Stencil Apertures to Compensate for Scooping During Printing Gabriel Briceno, Ph. D., Miguel Sepulveda; Qual-Pro Corporation This study
SMTnet Express, March 22, 2018, Subscribers: 30,947, Companies: 10,909, Users: 24,534 Using Lean Six Sigma to Optimize Critical Inputs on Solder Paste Printing Tom Watson; Kimball Electronics, Inc. Solder paste printing is the first step
