104 edge clearance results

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(clearance to the next card above the components) and lar

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A High Performance and Cost Effective Molded Array Package Substrate

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Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages This paper presents the drop test reliability results for edge-bonded 0.5mm pitch lead-free chip scale

SMTnet Express - November 26, 2020

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