BGA Package Component Reliability After Long-Term Storage BGA Package Component Reliability After Long-Term Storage In 2008, the white paper Component Reliability After Long Term Storage was published in support of shelf life extension
SMTnet Express, August 1, 2019, Subscribers: 32,197, Companies: 10,845, Users: 24,998 Tin Whiskers: Risks with Lead Free | Part I Credits: ACI Technologies, Inc. Tin (Sn) metal displays the characteristic of growing "tin whiskers" from pure tin
SMTnet Express, May 12, 2016, Subscribers: 24,536, Companies: 14,773, Users: 40,243 Influence of Plating Quality on Reliability of Microvias Yan Ning, Michael H. Azarian, Michael Pecht; CALCE Center for Advanced Life Cycle Engineering Advances
