Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures More and more chip packages need
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SMTnet Express, January 18, 2018, Subscribers: 31,180, Companies: 10,857, Users: 24,296 Fine Pitch Cu Pillar with Bond on Lead (BOL) Assembly Challenges for High Performance Flip Chip Package Nokibul Islam, Vinayak Pandey, KyungOe Kim; STATS Chip
SMTnet Express, August 14, 2014, Subscribers: 23098, Members: Companies: 13988, Users: 36651 Advanced Organic Substrate Technologies To Enable Extreme Electronics Miniaturization. Susan Bagen, Dave Alcoe, Kim Blackwell, Frank Egitto; i3
SMTnet Express, May 24, 2018, Subscribers: 31,054, Companies: 10,942, Users: 24,751 Wettable-Flanks: Enabler for the Use of Bottom-Termination Components in Mass Production of High-Reliability Electronic Control Units Udo Welzel, Marco Braun
Ceramic to Plastic Packaging If you don't see images please visit online version at: http://www.smtnet.com/express/ Ceramic to Plastic Packaging As electronic products increase in functionality and complexity, there is an emphasis
BGA Rework. A Comparative Study of Selective Solder Paste Deposition For Area Array Packages If you don't see the images, please visit online version at #Application.SmtNet.baseURL#/express/ News • Forums • SMT Equipment • Company Directory
Manufacturer of PCB depaneling and PCB soldering machines since 2005, products include CE approval V-groove PCB depanelizer, PCB router, PCB punching machine, laser depaneling, hot bar soldering machines and soldering robots.
Liwu Industrial Park, Yuanzhou Town, Boluo
Huizhou, 30 China
Phone: +86-138-29839112
