Advanced Thermal Interface Materials for Enhanced Flip Chip BGA Advanced Thermal Interface Materials for Enhanced Flip Chip BGA Increased functionality and performance requirements for microprocessors and ASICs have resulted in a trend
SMTnet Express, April 9, 2020, Subscribers: 35,627, Companies: 10,989, Users: 25,746 Soft Material-Enabled, Flexible Hybrid Electronics for Medicine, Healthcare, and Human-Machine Interfaces Credits: Washington State Magazine Flexible hybrid
electronics (FHE) interface rigid electronic com
