Strength of Lead-free BGA Spheres in High Speed Loading Strength of Lead-free BGA Spheres in High Speed Loading Concern about the failure of lead-free BGA packages when portable devices such as cell phones are accidentally dropped and a general
Inclusion Voiding in Gull Wing Solder Joints SMTnet Express August 30, 2012, Subscribers: 25432, Members: Companies: 8960, Users: 33565 Inclusion Voiding in Gull Wing Solder Joints First published in the 2012 IPC APEX EXPO technical conference
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AOI-AXI Duo Improves Product Yield News Forums SMT Equipment Company Directory Calendar Career Center Advertising About FREE Company Listing! AOI-AXI Duo Improves Product Yield Automated optical inspection (AOI) and automated X
SMT Express, Volume 4, Issue No. 5 - from SMTnet.com Volume 4, Issue No. 5 Thursday, May 23, 2002 Featured Article Return to Front Page Book Review Reviewed by Dave Fish (davef ), Pandion Electronics, Inc. Title: Reflow Soldering
SMTnet Express, Septemeber 1, 2016, Subscribers: 26,288, Companies: 14,937, Users: 41,025 Reliability Study of Low Silver Alloy Solder Pastes Jennifer Nguyen, David Geiger and Murad Kurwa; Flex (Flextronics International) Sn3.0Ag0.5Cu (SAC305
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