to package these devices in the flip-chip BGA form factor (
SMTnet Express, July 24, 2014, Subscribers: 22981, Members: Companies: 13953, Users: 36523 Copper Wire Bond Failure Mechanisms. Randy Schueller, Ph.D.; DfR Solutions Wire bonding a die to a package has traditionally been performed using either
SMTnet Express, December 12, 2013, Subscribers: 26406, Members: Companies: 13519, Users: 35511 Using Physics of Failure to Predict System Level Reliability for Avionic Electronics by Greg Caswell; DfR Solutions Today's analyses of electronics
