SMTnet Express, January 18, 2018, Subscribers: 31,180, Companies: 10,857, Users: 24,296 Fine Pitch Cu Pillar with Bond on Lead (BOL) Assembly Challenges for High Performance Flip Chip Package Nokibul Islam, Vinayak Pandey, KyungOe Kim; STATS Chip
SMTnet Express, May 7, 2020, Subscribers: 36,108, Companies: 11,001, Users: 25,793 Solutions for Selective Soldering of High Thermal Mass and Fine-Pitch Components Credits: Nordson SELECT The selective soldering process has evolved to become a
.png)
