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SMTnet Express, December 31, 2015, Subscribers: 23,946, Members: Companies: 14,865, Users: 39,660 Study on Solder Joint Reliability of Fine Pitch CSP Yong Hill Liang, Hank Mao, YongGang Yan, Jindong (King) Lee; AEG, Flex (Flextronics International
SMTnet Express, January 18, 2018, Subscribers: 31,180, Companies: 10,857, Users: 24,296 Fine Pitch Cu Pillar with Bond on Lead (BOL) Assembly Challenges for High Performance Flip Chip Package Nokibul Islam, Vinayak Pandey, KyungOe Kim; STATS Chip
SMTnet Express, April 30, 2020, Subscribers: 36,108, Companies: 10,995, Users: 25,780 Selective Solder Fine Pitch Components On High Thermal Mass Assembly Credits: ITW EAE The number of through-hole components on PCBs has declined significantly
SMTnet Express, December 20, 2018, Subscribers: 31,551, Companies: 10,666, Users: 25,526 Process Optimization for Fine Feature Solder Paste Dispensing Credits: Indium Corporation With the rapid trend towards miniaturization in surface mount
SMTnet Express, February 27, 2015, Subscribers: 22,336, Members: Companies: 14,215, Users: 37,692 Position Accuracy Machines for Selective Soldering Fine Pitch Components Gerjan Diepstraten; Vitronics Soltec B.V. The drive towards fine pitch
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