SMTnet Express, November 15, 2018, Subscribers: 31,472, Companies: 11,088, Users: 25,406 Status and Outlooks of Flip Chip Technology John H. Lau; ASM Pacific Technology Status of flip chip technology such as wafer bumping, package substrate, flip
Processing and Troubleshooting SMT, BGA, CSP and Flip Chip
SMTnet Express, June 19, 2014, Subscribers: 22851, Members: Companies: 13906, Users: 36363 Anisotropic grain growth and crack propagation in eutectic microstructure under cyclic temperature annealing in flip-chip SnPb composite solder joints Y
SMTnet Express, December 11, 2014, Subscribers: 23,586, Members: Companies: 14,135 , Users: 37,386 Failure Modes in Wire bonded and Flip Chip Packages Hikmat Chammas - Peregrine Semiconductor The growth of portable and wireless products is driving
Are Separate Solder Flip-Chip Bonders Still Required? Are Separate Solder Flip-Chip Bonders Still Required? Increasing miniaturization is now encouraging manufacturers of handheld devices to stack bare dies or packages. As the process
SMTnet Express, February 27, 2014, Subscribers: 22818, Members: Companies: 13775, Users: 35799 A Novel High Thermal Conductive Underfill For Flip Chip Appliation. Dr. Mary Liu and Dr. Wusheng Yin; YINCAE Advanced Materials, LLC. Silicon dioxide
SMTnet Express, May 29, 2014, Subscribers: 22783, Members: Companies: 13874, Users: 36243 Microspring Characterization and Flip-Chip Assembly Reliability B. Cheng, D. De Bruyker, C. Chua, K. Sahasrabuddhe, I. Shubin, J. E. Cunningham, Y. Luo, K. F
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