Express Newsletter: flip chip bonder (Page 1 of 39)

Are Separate Solder Flip-Chip Bonders Still Required?

Are Separate Solder Flip-Chip Bonders Still Required? Are Separate Solder Flip-Chip Bonders Still Required? Increasing miniaturization is now encouraging manufacturers of handheld devices to stack bare dies or packages. As the process

SMTnet Express - November 15, 2018

SMTnet Express, November 15, 2018, Subscribers: 31,472, Companies: 11,088, Users: 25,406 Status and Outlooks of Flip Chip Technology John H. Lau; ASM Pacific Technology Status of flip chip technology such as wafer bumping, package substrate, flip

SMT Express, Volume 4, Issue No. 5 - from SMTnet.com

Processing and Troubleshooting SMT, BGA, CSP and Flip Chip

SMTnet Express - June 19, 2014

SMTnet Express, June 19, 2014, Subscribers: 22851, Members: Companies: 13906, Users: 36363 Anisotropic grain growth and crack propagation in eutectic microstructure under cyclic temperature annealing in flip-chip SnPb composite solder joints Y

  1 2 3 4 5 6 7 8 9 10 Next

flip chip bonder searches for Companies, Equipment, Machines, Suppliers & Information

Void Free Reflow Soldering

Training online, at your facility, or at one of our worldwide training centers"
SMT feeders

High Resolution Fast Speed Industrial Cameras.
Online Equipment Auction Jabil Monterrey MX Aug 19, 2024

Software for SMT placement & AOI - Free Download.
PCB Handling with CE

High Throughput Reflow Oven