Express Newsletter: fr4 life cycle (Page 1 of 26)

Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints

Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints SMTnet Express September 13, 2012, Subscribers: 25475, Members: Companies: 8976, Users: 33645 Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints First published

SMTnet Express - December 27, 2019

SMTnet Express, December 27, 2019, Subscribers: 33,251, Companies: 10,949, Users: 25,451 A Life Prediction Model of Multilayered PTH Based on Fatigue Mechanism Credits: Beihang University PTH plays a critical role in PCB reliability. Thermal

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