Optimizing Thermal & Mechanical Performance in PCBs Optimizing thermal and mechanical performance in PCBs Engineers are always striving to make a lighter, faster and stronger PCB. In order to achieve their designs, engineers must turn
Advanced Thermal Interface Materials for Enhanced Flip Chip BGA Advanced Thermal Interface Materials for Enhanced Flip Chip BGA Increased functionality and performance requirements for microprocessors and ASICs have resulted in a trend
.png)
