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Accurate Quantitative Physics-of-Failure Approach to Integrated Circuit Reliability

Air Flow Measurement in Electronic Systems

Development of Ultra-Multilayer Printed Circuit Board

RF Packaging Advancements

"Green" Nanocomposites for Electronic Packaging

SMT Express, Issue No. 3 - from SMTnet.com

for missing balls (BGA's - figure 23), or bent or missing l

Joule Heating Effects on the Current Carrying Capacity of an Organic Substrate for Flip-Chip Applications

SMT Express, Volume 3, Issue No. 5 - from SMTnet.com

SMT Express, Volume 2, Issue No. 3 - from SMTnet.com

SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Curtailing Voids in Fine Pitch Ball Grid Array Solder Joints by Gary Morrison and Kevin Lyne

First Principles of Solder Reflow