Defect Free QFN Assembly Defect Free QFN Assembly The problem with soldering QFN packages is that they float, skew and tilt on the 'domed' melted solder during the SMT re-flow process. This floating, skewing and/or tilting will lead to solder
! Pin In Hole Intrusive Reflow P
hard place. There are few environments that are as
SMTnet Express, January 31, 2019, Subscribers: 31,643, Companies: 10,701, Users: 25,678 Novel Pogo-Pin Socket Design for Automated Low Signal Linearity Testing of CT Detector Sensor Credits: General Electric Due to the arrayed nature
Solder Paste Inspection Technologies: 2D-3D Correlation Solder Paste Inspection Technologies: 2D-3D Correlation It is understood that the solder paste printing process presents far more opportunities for defects than any of the other individual
SMT Express, Volume 5, Issue No. 2 - from SMTnet.com Volume 5, Issue No. 2 Wednesday, February 19, 2003 OnBoard Forum Who's OnBoard?Michael Sivigny Begins: Monday, March 3, 2003 8:00 AM ET Ends: Friday, March 7
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