254 glue on pads results

SMT Express, Volume 3, Issue No. 6 - from SMTnet.com

SMT Express, Issue No. 1 - from SMTnet.com

Assembly And Reliability Issues Associated With Leadless Chip Scale Packages

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Head-in-Pillow BGA Defects

Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint

BGA Package Component Reliability After Long-Term Storage

Aiming for High First-pass Yields in a Lead-free Environment

Screening for Counterfeit Electronic Components

SMT Express, Volume 2, Issue No. 1 - from SMTnet.com

Tackling SMT enemy number one – Raising the standard of solder paste application