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Discover New Technologies, Processes, Equipment and Solutions at IPC APEX EXPO 2012

Discover New Technologies, Processes, Equipment and Solutions at IPC APEX EXPO 2012 Discover New Technologies, Processes, Equipment and Solutions Printed Electronics, Defect Clinic and William Shatner Highlight IPC APEX EXPO 2012 The world

SMT Express Newsletter

SMT Express Newsletter Discover New Solutions At IPC Midwest IPC has launched a new Midwest trade show covering all aspects of the electronics industry — board design and manufacture and electronics assembly, manufacture and test. This event

A New (Better) Approach to Tin Whisker Mitigation

Solder Materials Science Gets Small as Miniaturization Challenges Old Rules

A Two-Layer Board Intellectual Property to Reduce Electromagnetic Radiation

Strength of Lead-free BGA Spheres in High Speed Loading

SMT Express, Issue No. 7 - from SMTnet.com

SMT Express, Volume 5, Issue No. 4 - from SMTnet.com

Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes

Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes